In the field of packaging, plastic packaging used leadframe as main raw material account for more than 80%. Copper alloy with good thermal conductivity, electrical conductivity and process ability are mainly used as leadframe raw material. Copper oxide and other pollutants will cause delamination between molding compound and leadframe, which will result in poor sealing performance. Chronic gas permeation will cause the oxidation of bonding wire and aluminum on circuit .The surface treatment processes and capability of Fullriver can settle all the troublesome and prevent the delamination from happen ,and meet the high level reliability requirement of MSL1.