Electroplating process

Leadframe is the basic material of semiconductor packaging and the carrier of integrated circuit chip. The internal circuit of the chip and external lead are connected by bonding wire. The main material for producing leadframe is alloy copper strip. In order to ensure the good bonding performance during the wire bonding process, special treatment should be done on the surface of lead ( wire bonding area) and pad  (die-attached area) of leadframe, including silver plating, nickel plating and etc. The electroplated leadframe has better conductivity and heat dissipation performance.